• Underfill

    It’s an adhesive for protecting BGA, CSP, Flip-chip and so on from Package and PCB contact failure due to physical and chemical impact.

  • UV adhesive

    This product is a liquid adhesive to harden in a short time and is utilized for various purposes such as setting parts, resisting moisture, coating, e...

  • SMT adhesive

    This product is utilized as an adhesive for Chip component in SMT process for high speed dispenser and print screen.

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nepcon south china nepcon south china

nepcon south china nepcon south china

nepcon south china nepcon south china

NEPCON China pre-registration

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Exhibition Hours
Day Time
Wednesday, August 28 10:00-17:00
Thursday, August 29 09:30-17:00
Friday,August 30 09:30-16:30
Visitor Hotline
International Callers:86-21-2231-7039
From within China:400-650-5611 or 86-10-5763-1818

Leading Exhibitors


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