TC 1.5

Solderability and Reliability Evolution of No-Clean Solder Fluxes For Selective Soldering

Abstract:Wave soldering still remains a must, with an increasing share of “selective” soldering processes. Such processes are more challenging for the fluxes in terms of reliability under operation, since some chemistries remaining on the printed circuit boards after soldering may promote corrosion.

The paper will cover the types of flux used in the electronic industry according to their chemistry and activation level, and their characteristics with reference to standards. The limits of current standards will be discussed in regards to the last generation solder fluxes.

Then, the development of two low-residue new generation fluxes, an alcohol-based flux and a true VOC-free flux, will be described. Reliability will be especially investigated through surface insulation resistance, electro-chemical migration test, ionic contamination as well as Bono tests to determine the candidates able to provide high processability combined with chemical inertness of residues. Finally, the performance of flux will be assessed through customer tests, involving several types of boards, finishes and different solder alloys and wave equipment.

 

选择性焊接用助焊剂的可焊性和可靠性发展趋势

摘要:随着选择性焊接的应用增加,助焊剂残留以及未活化部分在板上残留的可靠性被人们越来越关注。

文章从电子焊接用助焊剂的要求及分类讲起,通过实验分析来描述下一代助焊剂的开发趋势。

文中列举一种醇基助焊剂和一种VOC-free助焊剂为开发典型,研究了表面绝缘电阻,电化学迁移以及BONO测试等可靠性指标。最后测试助焊剂在客户实际单板,不同表面处理、不同合金以及不同设备上的性能表现。

深圳自动化展 深圳自动化展

深圳自动化展 深圳自动化展

深圳自动化展 深圳自动化展

深圳自动化展

深圳自动化展

参观时间
日 期 时 间
8月28日,星期三 10:00-17:00
8月29日,星期四 09:30-17:00
8月30日,星期五 09:30-16:30
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国内观众:4006505633或86-10-5763 1717
国际观众:86-21-2231-7039
中国汽车电子技术展览会 咨询热线
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国际观众:86-21-2231-7039
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