Technology Conference

SMTA China South Technology Conference

SMTA

 29th August 2017 (Tuesday)

(CS17-TC1) Technology Conference

Conference Chairman:
Henley Zhou
Member of SMTA China Technical Committee /
Director of Advanced Manufacturing Engineering, Asia of Flex

Venue

Booth 1T11, Hall 1, Shenzhen Convention & Exhibition Center, Shenzhen, China

Time

Topic

Speaker

10:30-11:05

Voiding Control At LED Die Attach Preform Soldering
(CS17-TC1.1)

Fiona Chen
Indium Corporation (Suzhou) Co., Ltd.

11:05-11:40

The Study of Cure Percentage Determination for Anisotropic Conductive Film By Ftir Method
(CS17-TC1.2)

   Henley Zhou 
    Flex

11:40-12:15

Light Out Electronics Assembly
(CS16-TC1.3)

Dr. Ranko Vujosevic  Ranko Vujosevic
Optimal Electronics Corporation

12:15-13:45

Lunch Break

13:45 – 14:20

Dielectric Material Characterization
for The PCB Pad Cratering Resistance
 (CS17-TC1.4)

Cheng-Chih Chen

Integrated Service Technology Inc.

14:20 - 14:55

The Impact of Reduced Solder Alloy Powder Size
On Solder Paste Print Performance
 (CS17-TC1.5)

Flopy Feng
AIM Solder (Shenzhen)
Company Limited

14:55 - 15:30

Low Insertion Force Compliant Pin Connector Assembly Challenge and Solution
(CS17-TC1.6)

Kiwi Yu
IBM Procurement China Limited

15:30 - 16:05

Failure Analysis Methods Research and Quality Control
On Nickel Corrosion of ENIG Solder Joints
(CS17-TC1.7)

Cong Mei
Shenzhen GreatWall Kaifa Technology Co., Ltd.

All papers will be presented in Chinese

30th August 2017 (Wednesday )

(CS17-TC2) Technology Conference
Conference Chairman
Henley Zhou
Member of SMTA China Technical Advisory Committee
Director of Advanced Manufacturing Engineering, Asia of Flex
Venue

Booth 1T11, Hall 1, Shenzhen Convention & Exhibition Center, Shenzhen, China

Time

Topic

Speaker

10:30-11:05

Comparing The Performance of Engineered Tin/Copper Alloys
In Selective Soldering
 (CS17-TC2.1)

Jackson Chan
Alpha Assembly Solutions

11:05-11:40

Assessment of Solder Paste Technology Limitation At Miniaturization for SIP and SMT Application
(CS17-TC2.2)

Fiona Chen
Indium Corporation (Suzhou)
Co., Ltd.

11:40-12:15

Qualification Test for Creep Corrosion Using Flower
of Sulfur Chamber
(CS17-TC2.3)

Dem Lee

IST Taiwan

12:15-13:45

Lunch Break

13:45-14:20

Electrochemical Migration  How Field Failures Occur
and How to Avoid Them
(CS17-TC2.4)

Albert Liu
ZESTRON Asia North

14:20-14:55

Failure Analysis Case Study of MLCC Component Crack With Application of FEA and Bend Test
(CS17-TC2.5)

Henley Zhou
Flex

14:55-15:30

Flip Chip LED Assembly By Solder Stamping /Pin-Transfer
(CS17-TC2.6)

Vincent Liu
Alpha Assembly Solutions

All papers will be presented in Chinese

Fee :RMB300/per day (including offical invoice)
Noted:

1. RMB285/per day for registering before 31 July and RMB540/two days for registering before 31 July

2. Deadline for registration and Conference Fee Collection is 25 August

Offer :

1. SMTA China Technology Conference Attendence Certificate 

2. Electronic Version of Conference Proceedings

3. Free Lunch Coupons
Email to:peggychen@smta.org.cn , Tel:+86 -21-56093010

NEPCON China pre-registration

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Day Time
Tuesday, August 28 10:00-17:00
Wednesday, August 29 09:30-17:00
Thursday,August 30 09:30-16:30
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