SMTA China South Conference 2014

SMTA China South Conference 2014 Conference Schedule

26-28 August 2014
Shenzhen Convention & Exhibition Centre,
Shenzhen, China

  • SMTA China South Conference 2014 Program

     
    25 August (Monday)
    26 August (Tuesday)
    27 August (Wednesday)
    28 August (Thursday)

    Technology Workshop

    09:00-17:00
         

    Technology Conference

     
    10:15-16:00
       

    Vendor Conference

     
    10:30-15:30
    10:30-12:30

    SMT Engineer Certification

     
    09:00-17:00

    SMTA China Annual Award Presentation

     
    15:30-16:30
       

    Trade Show

     
    NEPCON South China 2014

    The SMTA China will organize the SMTA China South Conference 2014 in Shenzhen on 26-28 August, 2014. This timely event will be held in conjunction with NEPCON South China 2014.  This events will address the industry’s most pressing issues in electronics assembly/ manufacturing, industry/ technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability.


     

  • Technology Conference/Vendor Conference Topics (26-28 August 2014)

    Advanced Packaging/ Components
    3D Packaging and Integration
    BGA/CSP
    Biomedical Packaging
    Bumping
    Chip on Board
    Copper Wire Bonding
    Direct Chip Attach
    Embedded and Miniature Passives
    Failure Analysis
    Fine Lead Pitch
    Flip Chip
    Hermetic Packaging for High Rel
    High Temperature Packaging
    Lead Finishes
    Leadless Pkgs (LGA/QFN/BTC)
    MEMS and Sensors
    Package on Package (PoP)
    Photonics
    Photovoltaics and Solar
    Reliability
    Through Silicon Vias (TSVs)
    Tin Whiskers
    Wafer Level Packaging (WLP)


    Business/Supply Chain
    Capacity Modeling
    Conflict Minerals
    Contract Manufacturing
    Doing Business in Asia
    Environmental Issues
    Lean Manufacturing
    Operations Management
    Remaining Competitive
    RoHS/REACH Compliance
    Supplier Management
    Technology Roadmaps


    Emerging Technologies
    0201/01005 Components/Assembly
    Advanced Packaging
    Consumer Applications
    Electronic Printing Technology
    Embedded Technology
    Flexible Electronics
    MEMS/RF
    MEMS/MOEMS
    Microsystems Packaging / Modular Microsystems
    Nanoelectronics
    Reliability of Nanodevices
    New Materials and Processes
    Optoelectronics
    Printed Electronics
    Power or Thermal Management
    Sensors and Manufacturing
    Solar Technology
    Solid State Lighting
    System in a Package
    Thermal Interface Materials
    Wireless Applications


    Harsh Environment Applications
    Alternate Energy
    Components and Reliability
    Corrosion
    Lead-free Issues
    Substrates and Finishes
    Thermal Management
    Tin Whiskers

    Assembly
    Adhesives
    Alternate Alloys
    BGA/CSP Assembly
    Cleaning
    Conformal Coating and Potting
    Connector Technology
    Copper Erosion
    DFX/Design for Six Sigma
    Dispensing
    Equipment Selection
    Facility Layout
    Flux and Solder
    Halogen and Halogen-Free
    Head on Pillow Defect/Warpage Induced Solder Joint Defects
    High Melting Point Solder
    Land Pattern Design
    Lead-Free Soldering/Reliability
    Lean Manufacturing
    Low Temperature Soldering
    Low Volume/Prototype
    Medical Electronics
    Placement
    Printing
    Reflow Soldering
    Rework and Repair of QFNs
    RFID Assembly
    Selective Soldering
    Set Up Reduction
    Solder Paste
    Solder Voids
    Supplier Engineering
    Underfill and Corner Glue
    Vapor Phase Reflow
    Wave Soldering
    Yield Improvement


    PCB Technology
    Black Pad and Surface Finish Defects
    Creep Corrosion
    Embedded Passive/Active Components
    Halogen Free
    HDI
    Microvias (including filled/unfilled)
    Moisture Sensitivity
    High Power PCBs
    Soldermask
    Substrate Reliability
    Substrate Solderability
    Surface Finish


    Process Control
    Acoustic Imaging (C-SAM)
    AOI
    CIM
    In-Circuit Test
    Process Modeling
    Software
    Solder Paste Inspection
    Test Strategies
    2D/3D X-Ray

  • SMT Engineer Certification (26-28 August 2014)

    SMTA Engineer Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes. The program concludes on days two and three with an open and closed book examination.

    This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes

    SMTA China Annual Award Presentation (26 August 2014)

    It is a great opportunity to meet with our friends in the SMT Industry at the SMTA China Annual Award Presentation. In addition, in order to appreciate the speakers of excellent information sharing, SMTA China would like to honor the best paper, and the speaker of best presentation, which award will be presented during the Annual Award Presentation of SMTA China.

    Enquiry and Registration: E-mail to peggychen@smta.org.cn

   NEPCON China pre-registration

    

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Exhibition Hours
Day Time
Tuesday, August 25 10:00-17:00
Wednesday, August 26 09:30-17:00
Thursday, August 27 09:30-16:30

Please send SMS “CNZ+Name+Company” to
106900297333 for Visiting Pre-registration of NEPCON South China 2015

Visitor Hotline
International Callers:86-21-2231-7011
From within China:400-650-5611 or 86-10-5763-1818

german-pavilion

Featured Exhibitors

First Technology FUJI
WKKalpha
凯能自动化日东电子科技
http://www.nordson.com/en-us/divisions/yestech/pages/default.aspx技鼎机电

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