In PCBA assembly of electronics, printing, a key part of the process, is integral to evaluating quality. Printing technology is synonymous with steel plate design, steel plate processing, tin paste performance and printing equipment. At the same time, high-speed jet printing technology, high-precision printing quality monitoring and other technologies are developing greatly. Therefore, the question of how to better apply such advanced technologies and improve product quality has become a hot industry topic.
In the SMT industry, printing problems account for over 60% of all bottlenecks. The development of consumables, industrial equipment, communication equipment and other electronics is driving the development of board manufacturing technology towards integration, high density and high reliability. At the same time, electronics have also become more compact, lighter, thinner, more multifunctional and more integrated. To better support the developing demand, during the process of electronics manufacturing, a greater number of new technologies like SIP technology, POP and 3D assembly are used.
Those wanting to learn more about printing and printing-related problems, can join the combined Eletrain and Reed Exhibitions event, featuring industry senior experts with extensive practical experience giving instructive presentations based on actual cases and popular, easy-to-understand theories. There will also be a Q&A session with experts. This is a rare platform for face-to-face communication with industry specialists and peers. Make the most of this rare opportunity and register today!