PE Forum

Time:

August 30, 2016
13:00 – 16:30  

Location:

Chrysanthemum Hall, 5F, Shenzhen Convention & Exhibition Center

 Sponsor:   
                      

Background:

In PCBA assembly of electronics, printing, a key part of the process, is integral to evaluating quality. Printing technology is synonymous with steel plate design, steel plate processing, tin paste performance and printing equipment. At the same time, high-speed jet printing technology, high-precision printing quality monitoring and other technologies are developing greatly.  Therefore, the question of how to better apply such advanced technologies and improve product quality has become a hot industry topic.

In the SMT industry, printing problems account for over 60% of all bottlenecks.  The development of consumables, industrial equipment, communication equipment and other electronics is driving the development of board manufacturing technology towards integration, high density and high reliability.  At the same time, electronics have also become more compact, lighter, thinner, more multifunctional and more integrated. To better support the developing demand, during the process of electronics manufacturing, a greater number of new technologies like SIP technology, POP and 3D assembly are used.

Those wanting to learn more about printing and printing-related problems, can join the combined Eletrain and Reed Exhibitions event, featuring industry senior experts with extensive practical experience giving instructive presentations based on actual cases and popular, easy-to-understand theories. There will also be a Q&A session with experts. This is a rare platform for face-to-face communication with industry specialists and peers.  Make the most of this rare opportunity and register today!

Participants:

Professionals from the fields of design, R&D, process, production, manufacturing, reliability, quality assurance and engineering

Agenda:
Time Topics and Speakers

13:00-13:30

Sign-in, Collection of Event Materials & Gifts

13:30-13:40

Speeches
13:40-14:25 

Application of Advanced SIP in Wearable Smart Products
Speaker: Dr. Wayne Koh, senior industry expert from the United States

14:25-15:10 Typical Cases of Printing and Electronic Assembly Technology
Speaker: Mr. Liu Zhe, Chief Engineer, Institute of Manufacturing Engineering, Department of Process Research, ZTE Corporation
15:10-16:00 Analysis of HIP and NOW Defects
Speaker: Senior industry expert, Dr. Ma Xin
16:00-16:30 Q&A with Experts
Moderator: Mr. Liu Zhe, Chief Engineer, Institute of Manufacturing Engineering, Department of Process Research, ZTE CorporationSpecial guests: Dr. Wayne Koh, Dr. Ma Xin
16:30 Lucky Draw, followed by close of Forum

Note: This is a draft version of the agenda and the organizers reserve the right to change it at any time. The final agenda will be given on the day of the forum.

NEPCON China pre-registration

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Exhibition Hours
Day Time
Tuesday, August 29 10:00-17:00
Wednesday, August 30 09:30-17:00
Thursday,August 31 09:30-16:30
Visitor Hotline
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From within China:400-650-5611 or 86-10-5763-1818

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