Electronics DFM Forum

Electronics DFM Forum

Time:13:30~16:30, Aug 29, 2017

Location:Tulip Hall, 6th Floor, Shenzhen Convention & Exhibition Center

Organized By:云创硬见、CCPIT、励展博览集团    

                       

会议背景
  • The electronics products are integrating more features while becoming smaller in size. The introduction of POP, 3D assembly, and SIP processes are posing increasingly complex challenges to design and production work. Manufacturability must be part of the overall process from the very start of plan and design, which in turn helps with reducing BOM costs, simplifying procurement, and optimizing workflows. Other key issues on the mind of manufacturers include the choice of high throughput and automated process, lowering production costs, avoiding complexities, and ensuring good manufacturability of designs.
  • To share electronics manufacturability experiences, top experts from top businesses invited by DFMaker will share case studies and provide systematic theories as they elaborate project planning, PCB design, SMT, components form factor, assembly, and other manufacturability issues. The experts will also share electronics manufacturing future trends at the exchange platform provided to electronics designers, manufacturers, and process providers.

Time

Topic

Speaker

Photo

Profile

13:10~13:30

Sign-in

 

13:30~14:00

SIP DFM Material Selection and Solution Design

Lin Zhenqing, Electronic Materials Solutions Director, KANA Technology

Henkel electronics first low temperature lead free and through hole reflow solder paste material solution totally responsible introducing process application engineering support, hand held mobile electronics device.

Henkel electronics first Japanese solder paste material solution totally responsible introducing process application engineering support, printer and projector main board device.

Henkel electronics nowadays solder contingency plan global expertise team member, responsible for all south China Key Accounts Management and R&D new product promotion;

14:30~15:00

DFX for R & D and Innovation

Yeaman Feng,VP,KingBrother

 

15:00~15:30

DFX of Mobile Devices

Hongfa Yu, Director of DFX, ZTE

 


15:30~16:00

Selecting High-Frequency and High-Speed Materials for PCBs in the 5G Communication Era

Luan Yi, Southern China Market Development Project Manager, Shengyi Technology

 


16:00~16:30

What's the Secret Behind International Brands’ High Quality Electronic Products? How Can the Core Capabilities of Design for X (DFX) Be Systematically Built?

Henley Zhou, Flextronics, Director of Advanced Manufacturing Engineering, Asia

The M.S. of Northwestern Poly-technical University,
The External Guider of MEM (Master of Engineering Management) in Jinan University
The member at association of American SMTA,
The member of the iNEMI Asia steering Committee,
The expert at the Committee of SMT Experts in Guangdong Institute of Electronics.

In charge of new manufacturing technology development & deployment, new product process
development, value engineering analysis, yield improvement and failure analysis for any engineering
escalation among different Asia sites. With 18 years’ work experience of process development,
manufacturing, DFX, and quality control on electronics products, he has issued more than 20
technical papers on international publication for different technical topics such as 01005, TMV PoP,
0.3mm CSP, head-in-Pillow (HiP), Non Wet Open (NWO), high temperature hot-bar, tolerance stackup
analysis (TSA) and six sigma methodologies etc.

NEPCON China pre-registration

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Exhibition Hours
Day Time
Tuesday, August 29 10:00-17:00
Wednesday, August 30 09:30-17:00
Thursday,August 31 09:30-16:30
Visitor Hotline
International Callers:86-21-2231-7142
From within China:400-650-5611 or 86-10-5763-1818

Featured Exhibitors

german-pavilion

First Technology FUJI
WKKalpha
凯能自动化日东电子科技
http://www.nordson.com/en-us/divisions/yestech/pages/default.aspx技鼎机电

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