SMTA China South Conference 2017 Program

Conference Agenda, Rre- Registration, SMTA China Award Nomination


29 August-30 August 2017
Shenzhen Convention & Exhibition Center, China

SMTA China South Conference 2017 Program

August 28
August 29
August 30
August 31

SMTA China South Technology Conference


SMTA China South Vendor Conference


SMTA Technology Workshop


Trade Show

The 23rd presentation microelectronics nepcon south china 2017

The SMTA China will organize the SMTA China South Conference 2017 in Shenzhen . This timely event will be held in conjunction with NEPCON South China 2017. This events will address the industry’s most pressing issues in electronics assembly/ manufacturing, industry/ technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability.

Technology Conference/Vendor Conference Topics (30 August-1 Septermber )

Topical coverage includes:
Advanced Packaging/ Components:
2.5/3D Packaging and Integration
Biomedical Packaging
Chip on Board
Copper Wire Bonding
Direct Chip Attach
Embedded and Miniature Passives
Failure Analysis
Fine Lead Pitch
Flip Chip
Hermetic Packaging
High Temperature Packaging
Lead Finishes
Leadless Packages (LGA/QFN/BTC)
MEMS and Sensors
Package on Package (PoP)
Photovoltaics and Solar
Through Silicon Vias (TSVs)
Tin Whiskers
Wafer Level Packaging (WLP)

01005/03015 Components/Assembly
3D Board Assembly
Additive Manufacturing
SMT Adhesives
Alternate Solder Alloys
BGA/CSP Assembly
Bottom Terminated Components
Cavity Board Assembly
Cleaning, Conformal Coating and Potting
Connector Assembly to PCB
DFX/Design for Six Sigma
Direct Chip Attach to PCB (DCA)
Dispensing & Underfill
Epoxy Fluxes
Facility Layout
Halogen and Halogen-Free
Head on Pillow Defect/Warpage Induced Solder Joint Defects
High Melting Point Solder
Laser Soldering
Leadless Area Array Packages
Lead-Free Soldering/Reliability
Low Temperature Processing
Low Volume/Prototype
Non-Wet Open (NWO) Defects
Package-on-Package Assembly
Part Obsolescence
Reflow Soldering/ Wave Soldering
Rework and Repair of QFNs (01005, Leadless Components, PoP, Rework Reliability
Robotic Soldering
Selective Soldering
Solder Jetting
Solder Paste/Solder Voids in Joints
Solderless Interconnections
Supplier Engineering
Thermo Compression Bonding
Underfill/ Corner Glue/ Other Polymeric Reinforcements
Vapor Phase Reflow
Yield Improvement

Business/Supply Chain:
Capacity Modeling
Conflict Minerals
Contract Manufacturing
Doing Business in Asia, Environmental Issues
Lean Manufacturing
Operations Management
RoHS/REACH Compliance
Supplier Management
Technology Roadmaps

Emerging Technologies:
<= 0.3mm Pitch Area Array Technologies
3D Circuits
3D Printing & Design Rules
Advanced Packaging
Assembly to Flex Substrates
Assembly to Glass Substrates
Cavity Assembly
Consumer Applications
Embedded Active Technology
Embedded Passive Technology
Flexible Electronics
Jetting of Solder Pastes
LED Technology/Assembly/Reliability
Microsystems Packaging / Modular Microsystems
Nanotechnology, Materials, & Electronics
New Materials and Processes
Plastic 3D PCB to PCB Technology
Power or Thermal Management
Power Electronics
Printed Electronics Technology
Reliability of Nanodevices
Resin Reinforcement Solder Pastes
Sensors and Manufacturing
Smart Manufacturing Systems
Small Die Size Singulation
Solid State Lighting
Solar Technology
System in a Package
Thermal Interface Materials
Touch Screen Technologies
Virtual Prototyping
Wearable Electronics
Wireless Applications

Harsh Environment Applications (Military, Aerospace, Automotive, Industrial, Oil & Gas)
Alternate Energy
Battery Prognostics
Components and Reliability
Copper Corrosion
High Lead Solder Replacement
High Temperature Electronics
Lead-free Issues
Non-Destructive Inspection
Micro-Computed Tomography
Multiphysics Modeling
Substrates and Finishes
Thermal Management
Tin Whiskers

PCB Technology :
Bio-Compatible Substrates
Black Pad and Surface Finish Defects
Conductive Anodic Filament (CAF)
Creep Corrosion
Embedded Passive/Active Components
Halogen Free
High Power PCBs
Micro-vias (including filled/unfilled)
Moisture Sensitivity
New Laminate Materials
New Surface Finishes & Solderability
Pad Cratering
Substrate Reliability

Process Control:
Acoustic Imaging(C-SAM) Benefits of AOI&SPI
In-Circuit Test
Process Modelling
Test strategles
2D/3D X-Ray

nepcon south china nepcon south china

nepcon south china nepcon south china

nepcon south china nepcon south china

NEPCON China pre-registration

Join and Follow Us
facebook twitter linkedin
Exhibition Hours
Day Time
Tuesday, August 28 10:00-17:00
Wednesday, August 29 09:30-17:00
Thursday,August 30 09:30-16:30
Visitor Hotline
International Callers:86-21-2231-7039
From within China:400-650-5611 or 86-10-5763-1818

Leading Exhibitors

Related Events

We use cookies to operate this website and to improve its usability. Full details of what cookies are, why we use them and how you can manage them can be found by reading our Privacy & Cookies page. Please note that by using this site you are consenting to the use of cookies.