SMTA Conference

Conference Agenda, Rre- Registration, SMTA China Award Nomination


SMTA

30 August-1September 2016
Shenzhen Convention & Exhibition Center, China

SMTA China South Conference 2016 Program

 
30 August(Tuesday)
31August(Wednesday)
1 September(Thursday)

Technology

10:30-15:00
10:30-15:30

Vendor Conference

10:30-15:30
10:30-12:30

SMTA China 10th Anniversary Reception

15:30-17:00
   

Trade Show

NEPCON South China 2016

The SMTA China will organize the SMTA China South Conference 2016 in Shenzhen on 30 August-1September, 2016. This timely event will be held in conjunction with NEPCON South China 2016. This events will address the industry’s most pressing issues in electronics assembly/ manufacturing, industry/ technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability.

Technology Conference/Vendor Conference Topics (30 August-1 Septermber 2016)

Topical coverage includes:
Advanced Packaging/ Components:
2.5/3D Packaging and Integration
BGA/CSP
Biomedical Packaging
Bumping
Chip on Board
Copper Wire Bonding
Direct Chip Attach
Embedded and Miniature Passives
Failure Analysis
Fine Lead Pitch
Flip Chip
Hermetic Packaging
High Temperature Packaging
Lead Finishes
Leadless Packages (LGA/QFN/BTC)
MEMS and Sensors
Package on Package (PoP)
Photonics
Photovoltaics and Solar
Reliability
Through Silicon Vias (TSVs)
Tin Whiskers
Wafer Level Packaging (WLP)

Assembly:
01005/03015 Components/Assembly
3D Board Assembly
Additive Manufacturing
SMT Adhesives
Alternate Solder Alloys
BGA/CSP Assembly
Bottom Terminated Components
Cavity Board Assembly
Cleaning, Conformal Coating and Potting
Connector Assembly to PCB
DFX/Design for Six Sigma
Direct Chip Attach to PCB (DCA)
Dispensing & Underfill
Epoxy Fluxes
Facility Layout
Halogen and Halogen-Free
Head on Pillow Defect/Warpage Induced Solder Joint Defects
High Melting Point Solder
Laser Soldering
Leadless Area Array Packages
Lead-Free Soldering/Reliability
Low Temperature Processing
Low Volume/Prototype
Non-Wet Open (NWO) Defects
Package-on-Package Assembly
Part Obsolescence
Placement
Printing
Reflow Soldering/ Wave Soldering
Rework and Repair of QFNs (01005, Leadless Components, PoP, Rework Reliability
Robotic Soldering
Selective Soldering
Solder Jetting
Solder Paste/Solder Voids in Joints
Solderless Interconnections
Supplier Engineering
Thermo Compression Bonding
Underfill/ Corner Glue/ Other Polymeric Reinforcements
Vapor Phase Reflow
Yield Improvement

Business/Supply Chain:
Capacity Modeling
Conflict Minerals
Contract Manufacturing
Doing Business in Asia, Environmental Issues
Lean Manufacturing
Onshoring
Operations Management
Remaining
Competitive
RoHS/REACH Compliance
Supplier Management
Technology Roadmaps

Emerging Technologies:
<= 0.3mm Pitch Area Array Technologies
3D Circuits
3D Printing & Design Rules
Advanced Packaging
Assembly to Flex Substrates
Assembly to Glass Substrates
Cavity Assembly
Consumer Applications
Embedded Active Technology
Embedded Passive Technology
Flexible Electronics
Jetting of Solder Pastes
LED Technology/Assembly/Reliability
MEMS/RF/MOEMS
Microsystems Packaging / Modular Microsystems
Nanomaterials
Nanotechnology, Materials, & Electronics
New Materials and Processes
Optoelectronics
Plastic 3D PCB to PCB Technology
Power or Thermal Management
Power Electronics
Printed Electronics Technology
Reliability of Nanodevices
Resin Reinforcement Solder Pastes
Sensors and Manufacturing
Smart Manufacturing Systems
Small Die Size Singulation
Solid State Lighting
Solar Technology
System in a Package
Thermal Interface Materials
Touch Screen Technologies
Virtual Prototyping
Wearable Electronics
Wireless Applications

Harsh Environment Applications (Military, Aerospace, Automotive, Industrial, Oil & Gas)
Alternate Energy
Battery Prognostics
Components and Reliability
Copper Corrosion
COTS
High Lead Solder Replacement
High Temperature Electronics
Lead-free Issues
Non-Destructive Inspection
Micro-Computed Tomography
Multiphysics Modeling
Substrates and Finishes
Thermal Management
Tin Whiskers

PCB Technology :
Bio-Compatible Substrates
Black Pad and Surface Finish Defects
Conductive Anodic Filament (CAF)
Creep Corrosion
Embedded Passive/Active Components
Halogen Free
HDI
High Power PCBs
Micro-vias (including filled/unfilled)
Moisture Sensitivity
New Laminate Materials
New Surface Finishes & Solderability
Pad Cratering
Soldermask
Substrate Reliability

Process Control:
Acoustic Imaging(C-SAM) Benefits of AOI&SPI
CIM
In-Circuit Test
Process Modelling
Software
Test strategles
2D/3D X-Ray

SMTA China 10th Anniversary Reception (30 August 2016)

It is a great opportunity to meet with our friends in the SMT Industry at the SMTA China Anniversary Reception. In addition, in order to appreciate the speakers of excellent information sharing, SMTA China would like to honor the best paper, and the speaker of best presentation, which award will be presented during the 10th Anniversary Reception of SMTA China.

Enquiry and Registration: E-mail to peggychen@smta.org.cn

NEPCON China pre-registration

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Exhibition Hours
Day Time
Tuesday, August 29 10:00-17:00
Wednesday, August 30 09:30-17:00
Thursday,August 31 09:30-16:30
Visitor Hotline
International Callers:86-21-2231-7142
From within China:400-650-5611 or 86-10-5763-1818

Featured Exhibitors

german-pavilion

First Technology FUJI
WKKalpha
凯能自动化日东电子科技
http://www.nordson.com/en-us/divisions/yestech/pages/default.aspx技鼎机电

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