Technology Forum:“New Electronic Assembly Materials”

Time: August 30,2016
9:30-16:10
Location: Tulip Hall, 6F, Shenzhen Convention & Exhibition Center

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Background

As electronics develop towards being smaller, lighter, thinner and towards having even more functions, consumers are also demanding higher levels of performance, safety and reliability.  This means that the manufacturing technique of electronic products must constantly improve: a tough challenge for the electronics assembly materials in each part of the production process.

To ensure a smooth manufacturing process and reliable product quality, understanding how to get new efficient, safe, low-cost and environment-friendly electronic assembly materials has become a key topics in electronic manufacturing. New electronic assembly materials must adapt to current manufacturing and production processes, and meet product design requirements, in order to cater to diversified demand of existing electronic products and help more electronic manufacturing enterprises realize the development target of energy consumption reduction, efficiency improvement and cost reduction!

As new electronics assembly materials continue to develop, new materials emerge and industry attention rises, this forum will closely examine the techniques used to make new electronic assembly materials and their application.  Soldering tin materials, flux materials, adhesives, under-fill materials, cleaning materials, conformal coating materials, semiconductor materials, printed circuit board materials and other new products and new technologies will all be discussed.  There will also be a thorough analysis of integrated solution of electronics assembly material system, based on actual cases!

Target Audience

Manufacturers from the following fields will be onsite: consumer electronics and home appliances, electronic manufacturing services / original design / original equipment, communications, automotive electronics, computers / systems and peripherals, control / safety / testing services, LED, avionics and military electronics, PCB production, integrated circuits, solar cell and module manufacturing, medical electronic equipment , IC packaging and touch screens / panel displays.

Agenda:
Time Topic speaker
9:30-10:00 Sign-in and Gift Award
10:00-10:35 Development Trends and Features of New Low-Cost Tin Paste Materials

Xu Jinhua, R&D Director,

Shenzhen YIK SHING TAT Industrial Co., Ltd.
10:35-11:15 Detailed Analysis: Application of PCBA Conformal Coating Techniques Song Shipeng, Key Product Manager, H K Wentworth China Branch
11:15-11:50 Optimizing Thermal Management Design, Improving Battery Performance in New Energy Vehicles Derek Du, Technical Service Manager, Henkel Electronic Materials LLC
11:50-11:55 Quiz with Prizes and Lucky Draw
Afternoon Agenda
13:40-14:15 Test, Failure Analysis Technology and Case Study of PCB and Electronic Assembly Materials

Wang Junzhao, R&D Manager,

Shenzhen Meixin Testing Technology Co., Ltd.
14:15-14:50 Enhancing Production Efficiency and Solving Safety Bottlenecks with New Conformal Coating Materials

Zhu Xiongwei General Manager

Shenzhen Jiexintai Technology Co., Ltd.
14:50-15:25 Usage and Development Trends of  Conductive Solid Crystal Adhesive in Electronic Packaging

Wan Chao, Project Manager, Technology Development Department

Chinese Electrical Science Research Institute Co., Ltd.
15:25-16:00 Cleaning Products Against High Precision Assembly, Process Requirements

Chen Dehua, Technical Service Manager, Shenzhen LanlinDechuang

Technology Co., Ltd.
16:00-16:10 Quiz with Prizes and Lucky Draw


Note: This is a draft agenda subject to ongoing changes. The final version will be released onsite at the seminar.

NEPCON China pre-registration

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