As electronics develop towards being smaller, lighter, thinner and towards having even more functions, consumers are also demanding higher levels of performance, safety and reliability. This means that the manufacturing technique of electronic products must constantly improve: a tough challenge for the electronics assembly materials in each part of the production process.
To ensure a smooth manufacturing process and reliable product quality, understanding how to get new efficient, safe, low-cost and environment-friendly electronic assembly materials has become a key topics in electronic manufacturing. New electronic assembly materials must adapt to current manufacturing and production processes, and meet product design requirements, in order to cater to diversified demand of existing electronic products and help more electronic manufacturing enterprises realize the development target of energy consumption reduction, efficiency improvement and cost reduction!
As new electronics assembly materials continue to develop, new materials emerge and industry attention rises, this forum will closely examine the techniques used to make new electronic assembly materials and their application. Soldering tin materials, flux materials, adhesives, under-fill materials, cleaning materials, conformal coating materials, semiconductor materials, printed circuit board materials and other new products and new technologies will all be discussed. There will also be a thorough analysis of integrated solution of electronics assembly material system, based on actual cases!